Abstract
Emerging technologies for three-dimensional integration of sensors, electronics for signal processing and communication enable a wide range of new applications. Due to interconnect structures in the third dimension new functional concepts, but also opportunities for improved thermal management or electromagnetic shielding become possible. However, designers are faced with new challenges in 3 D integration, coming from:
- influence of inter-chip via (ICV) structures on signal propagation,
- increased heating of layers, arise from dense integration and
- different mounting conditions of dies within the stack structure compared to mature packaging technologies.
This may cause:
- modivied behavior of devices and circuits, sensor elements as well as of the entire system and
- reliability issues.
Furthermore, additional pad and shape constraints due to 3D interconnect technology have to be considered.
Thus, the application of 3D integration technologies is associated with a couple of uncertainties. To proceed towards real 3D design it is necessary to have information about the influence of the integration technology on the system behavior. Therefore, investigations by measurements of the structures and by multi physics simulations are needed to achieve this information and provide it as design rules or guidelines.