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Packaging, interconnection, assembly - packaging innovations for novel products

Leveraging PCB technology for system level integration
 
: Jung, E.; Pötter, H.; John, L.-G.

MST News (2009), No.3, pp.4-8
ISSN: 0948-3128
English
Journal Article
Fraunhofer IZM ()
packaging; interconnection; assembly; SIP; heterogeneous integration; embedding

Abstract
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and will be for the future, in particular for smart systems. Their role has so far been limited to provide mechanical carrier and electrical routing functionality. Now, emerging technologies based on innovative interpretation of printed circuit board processes have been developed which will shape the perception of the printed circuit board in a new way. In terms of applications, a strong link exists between the development of components and system-oriented integration technologies such as system-in-package as well as the PCB. The operation environment, which has traditionally been defined by the needs of electronics, is nowadays increasingly determined by the application, such as by "under the hood" environments in the automotive industry or by the human body for implantable medical devices. Due to the increasingly central role of electronics in ensuring system reliability and functionality, the reliability of electronics built on and in the PCB will be a primary issue in the future. At present, system integration is still dominated by single-chip packaging and the few stacked-die (System-in-Package SiP) solutions employed are primarily based on wire bonding. Also, the PCB serves as a carrier platform only. High-density interconnect (HDI) multilayer boards are the most advanced substrate boards currently available. Unlike in the integrated circuit industry, where electrical, thermal and mechanical characterization is undertaken on the complete design, in SiP solutions, the chips, package and board continue to be designed separately. However, this will not be sufficient to meet the requirements of advanced product solutions in the future. User demand will push the PCB to new challenges and heights.

: http://publica.fraunhofer.de/documents/N-96939.html