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Testing of surface strength of solar wafers by application of bending tests

: Faber, T.; Kohn, C.; Kübler, R.; Kleer, G.


Lincot, D. ; European Commission, Joint Research Centre -JRC-:
The compiled state-of-the-art of PV solar technology and deployment. 23rd European Photovoltaic Solar Energy Conference, EU PVSEC 2008. Proceedings. CD-ROM : Held in Valencia, Spain, 1 - 5 September 2008; Proceedings of the international conference
München: WIP-Renewable Energies, 2008
ISBN: 3-936338-24-8
ISBN: 978-3-936338-24-9
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <23, 2008, Valencia>
Conference Paper
Fraunhofer IWM ()
silicon wafer; strength; bending test

In the manufacturing process the surfaces of solar cells are exposed to several kinds of thermal and mechanical loads. These loadings may lead to an increase of micro crack damages and changes of the strength properties of wafers in the processing lines and of finished solar cells. For the control of the processing and the evaluation of the mechanical performance of wafers quantities related to mechanical strength are needed. To characterize the surface strength of thin wafers (~100 µm) several kinds of bending tests are applied. In the present work the concentric ring test and the ball on ring test (see Figures 1 and 2) are considered particularly with respect to stress configuration and application to the testing of thin wafers.