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2008
Conference Paper
Titel
Testing of surface strength of solar wafers by application of bending tests
Abstract
In the manufacturing process the surfaces of solar cells are exposed to several kinds of thermal and mechanical loads. These loadings may lead to an increase of micro crack damages and changes of the strength properties of wafers in the processing lines and of finished solar cells. For the control of the processing and the evaluation of the mechanical performance of wafers quantities related to mechanical strength are needed. To characterize the surface strength of thin wafers (~100 µm) several kinds of bending tests are applied. In the present work the concentric ring test and the ball on ring test (see Figures 1 and 2) are considered particularly with respect to stress configuration and application to the testing of thin wafers.