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Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination

 
: Lang, K.-D.; Goehre, J.; Schneider-Ramelow, M.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2008, 10th Electronics Packaging Technology Conference : 9th-12th December 2008, Singapore
New York, NY: IEEE, 2008
ISBN: 978-1-4244-2117-6
ISBN: 978-1-4244-2118-3
pp.1164-1170
Electronics Packaging Technology Conference (EPTC) <10, 2008, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-96232.html