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Verfahren zum Verbinden einer Edelmetalloberflaeche mit einem Polymer

Connecting a precious metal surface to a polymer, comprises depositing a layer made of gold and silver on a substrate and then selectively removing the silver to produce nanoporous gold layer, and applying a fluid polymer to the gold layer
 
: Oppermann, H.

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Frontpage ()

DE 102007055018 A: 20071114
DE 102007055018 A: 20071114
B82B0003
H01L0021
B81C0001
B81B0001
C25D0003
C23C0014
German
Patent
Fraunhofer IZM ()

Abstract
(A1) Es wird ein Verfahren zum Verbinden einer Edelmetalloberflaeche mit einem Polymer vorgeschlagen, bei dem eine Schicht aus 20% bis 40% Gold und 80% bis 60% Silber auf einen Traeger abgeschieden wird und anschliessend das Silber zur Erzielung einer nanoporoesen Goldschicht selektiv entfernt wird. Auf die Goldschicht wird ein fluessiges Polymer aufgetragen und ausgehaertet.

 

WO 2009062753 A1 UPAB: 20090609 NOVELTY - The method for connecting a precious metal surface to a polymer, comprises depositing a layer made of gold (20-40%) and silver (80-60%) on a substrate (1) in galvanic and/or electro-chemical way by evaporating or sputtering and then selectively removing the silver by electrolytically reversing the galvanic deposition or by etching the silver to produce a nanoporous gold layer (4), and applying a fluid polymer to the gold layer and then hardening. The substrate is used as boards in electronics, microelectronics, micro-mechanics and/or micro-optics and is a semiconductor wafer. DETAILED DESCRIPTION - The method for connecting a precious metal surface to a polymer, comprises depositing a layer made of gold (20-40%) and silver (80-60%) on a substrate (1) in galvanic and/or electro-chemical way by evaporating or sputtering and then selectively removing the silver by electrolytically reversing the galvanic deposition or by etching the silver to produce a nanoporous gold layer (4), and applying a fluid polymer to the gold layer and then hardening. The substrate is used as boards in electronics, microelectronics, micro-mechanics and/or micro-optics, is a semiconductor wafer, a semiconductor chip or a single-layered or multi-layered circuit board and is provided with electrically conducting structured metallizations. The nanoporous gold layer is applied on an already existing layer made of gold. The nanoporous gold layer is deposited on the wafer with microelectronic circuits or micromechanical elements or on organic laminates, ceramics or glass, is deposited on semiconductor materials for producing a rewiring structure or on a circuit board for producing a multilayer circuit and serves for producing a stacked arrangement from microelectronic circuits or micromechanical or micro-optical elements on the basis of semiconductor. A plating base (2) or an adhesion layer is applied on the substrate with adhesive reinforcement before the deposition step and is lithographically structured. A lacquer mask used for structuring the layer to be deposited is removed before or after removing the silver. A galvanic starting layer is removed before applying the gold-silver layer (3) and removing the lacquer mask. The silver is alloyed and the adhesive layer is removed without masking the nanoporous gold by a further lacquer mask in a suitable aqueous solution. The nanoporous gold layer is tempered for adjusting the pore size, is structured and is pre-treated by reactive ion etching or hydrophilizing for wetting. The polymer is vapor-deposited and is set in a liquid condition for penetrating into the nanoporous gold layer under vacuum. The polymer layer (5) is structured and is polymerized and cross-linked after applying and penetrating into the sponge-like gold layer. The polymer is formed as organic dielectric, solder resist and/or passivation layer on the wafer and is formed on the chip after isolation. INDEPENDENT CLAIMS are included for: (1) microelectronic, micromechanical or micro-optical element having a precious metal surface connecting with a polymer; and (2) a circuit board made of organic material. USE - Method for connecting a precious metal surface to a polymer for semiconductor materials, circuit boards in microelectronic, micromechanical or micro-optical applications and micro-electronic and micromechanical semiconductor wafers. ADVANTAGE - The method is capable of economically connecting the precious metal surface to the polymer with high adhesive stability and less material consumption.

: http://publica.fraunhofer.de/documents/N-95816.html