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In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features

 
: Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.

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Circuits Multi-Projets -CMP-, Grenoble; IEEE Components, Packaging, and Manufacturing Technology Society:
Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems 2008 : Rome, Italy, 24 - 26 September 2008
Piscataway/NJ: IEEE, 2008
ISBN: 978-1-4244-3365-0
pp.112-117
International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) <14, 2008, Rome>
English
Conference Paper
Fraunhofer ENAS ()
Fraunhofer IZM ()

Abstract
Thermal characterisation of thermal interfaces becomes even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials as more accurate measurement techniques are required. As in parallel the quest for high conductivity adhesives and greases is ongoing, a correlation between thermal bulk or interface properties and structure is in high demand. We have developed test-stands for various classes of thermal interface materials. These permit characterisation for materials with thin bond line thickness and high thermal conductivity still using steady state techniques. The methods are benchmarked for greases, adhesives and sintered silver. For the latter, the technology development is described. Then, structural features such as particle density and porosity are examined. It will be the aim to compare and correlate them to thermal resistance. Part of the work has been accomplished within the running EU. Project "Nanopack".

: http://publica.fraunhofer.de/documents/N-94773.html