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Minimizing electromagnetic interference in power-ground cavities

 
: Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
EDAPS 2008, Electrical Design of Advanced Packaging and Systems Symposium : December 10 - 12, 2008, Seoul, Korea
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2633-1
pp.128-131
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <2008, Seoul>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this paper, electromagnetic interference (EMI) in power-ground cavities is quantified for conventional layer stack-ups used in low-cost electronic packaging. Traditional methods to niinimize EMI and their limitations are discussed. Our novel approach to minimize EMI by minimizing/preventing the excitation of parallel-plate-modes in power ground cavities is then presented. Finally, the advantages of our approach in ensuring Electromagnetic Reliability (EMR) of microsystems are discussed.

: http://publica.fraunhofer.de/documents/N-94743.html