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Multiscale mechanics modeling of direct silicon wafer bonding

: Kubair, D.V.; Cole, D.J.; Ciacchi, L.C.; Spearing, S.M.


Scripta materialia 60 (2009), No.12, pp.1125-1128
ISSN: 1359-6462
Journal Article
Fraunhofer IFAM ()

The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.