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Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology

 
: Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
EDAPS 2008, Electrical Design of Advanced Packaging and Systems Symposium : December 10 - 12, 2008, Seoul, Korea
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2633-1
pp.206-209
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <2008, Seoul>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The viability of multimode high-speed transmission structures in 3D silicon system-in-package modules is examined with full-wave simulations. Multimode transmission is achieved by integrating a stripline into a dielectric filled waveguide built over a silicon substrate shielded with walls instead of the via fence used in the traditional substrate integrated waveguide (SIW) structure. Isolation and transmission properties are evaluated using the full-wave solver Ansoft HFSS. The improvement of shielding walls eliminates potential bandgaps, offers a more predictable response, a reduces attenuation at high frequencies by 10% on the TEM mode.

: http://publica.fraunhofer.de/documents/N-94241.html