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MID (Moulded Interconnect Devices)

 
: Langhoff, W.

Krieger, J. ; Fraunhofer-Institut für Produktionstechnik und Automatisierung -IPA-, Stuttgart:
Wire harness technology and alternative wiring technologies for the future : Chengdu, Sichuan, PR China, October 2001
Stuttgart, 2001
CCA Conference Wire Harness Technology and Alternative Wiring Technologies for the Future <2001, Chengdu>
English
Conference Paper
Fraunhofer IPA ()
MID; Spritzgegossene Schaltungsträger; Heißprägen; hot embossing; 2-Komponenten-Spritzguß; two shot molding; laser imaging; Laserstrukturierung; Verbindungstechnologie

Abstract
Manufacturing technologies and the development of MID products are discussed. Topics are the technologies hot embossing, film techniques, two shot molding and laser imaging. Further points are the selection of the appropiate production technology, general obstacles and joining technology.

: http://publica.fraunhofer.de/documents/N-9404.html