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Through silicon vias as enablers for 3D systems

 
: Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.

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Design, Test, Integration and Packaging of MEMS/MOEMS : Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS; 9-11 April 2008, Nice, France
Grenoble: CMP, 2008
ISBN: 978-2-35500-006-5
pp.119-122
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2008, Nice>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's.

: http://publica.fraunhofer.de/documents/N-93868.html