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Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications

 
: Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.

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Fulltext urn:nbn:de:0011-n-938309 (306 KByte PDF)
MD5 Fingerprint: c95645af0475c150db5ad67536bfa897
Created on: 19.12.2013


Vincenzini, P.:
Smart Textiles. 3rd International Conference on Smart Materials, Structures and Systems 2008 : Acireale, ITALY, JUN 08-13, 2008
Clausthal-Zellerfeld: Trans Tech Publications, 2009 (Advances in science and technology 60)
ISBN: 978-3-908158-26-4
ISBN: 3-908158-26-5
ISSN: 1662-0356
pp.85-94
International Conference Smart Materials, Structures and Systems <3, 2008, Acireale, Sicily>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()

Abstract
This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

: http://publica.fraunhofer.de/documents/N-93830.html