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Embedded chip packages - technology and application

 
: Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.

Surface Mount Technology Association -SMTA-:
SMTA International Conference 2008. Proceedings. Vol.1 : August 17-21 2008, Orlando, Florida, USA
Edina, Minn.: SMTA, 2008
ISBN: 978-1-6056-0543-2
pp.43-48
Surface Mount Technology Association (SMTA International Conference) <2008, Orlando/Fla.>
English
Conference Paper
Fraunhofer IZM ()
3D packaging; embedded chip; chip in polymer; SIP

Abstract
In this paper the realization of packages and System-in-Packages (SIP) with embedded components will be described. Embedding of semiconductor chips into substrates has several advantages. It allows a very high degree of miniaturization, due to the possibility of sequentially stacking of multiple layers containing embedded components. A further advantage is the beneficial electrical performance by short and geometrically well controlled interconnects. In addition the embedding gives a homogeneous mechanical environment of the chips, resulting in good reliability. Furthermore this technology is also extended for high frequency, automotive radar application. Here the use of RF compatible materials is essential. Adaption of this technology towards the RF compatibility will be described, as well as first realized demonstrators. As a result of the increasing interest in implementing embedding technologies in an industrial environment, a newly established European project “HERMES” will focus mainly on industrial adaptation of embedding technologies with an additional scope of furthering also the existing technological capabilities at prototype level. The goal is to realize a new integrated manufacturing line to offer low cost solutions for high density electronic systems. New manufacturing and technological challenges arise from the industrialization of component embedding technologies. The new manufacturing process should combine PCB processing and die assembly in one production line in order to benefit the most from this combination without the difficulties of transport between different manufacturing plants.

: http://publica.fraunhofer.de/documents/N-92452.html