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Industrial and technical aspects of chip embedding technology

 
: Ostmann, A.; Manessis, D.; Stahr, J.; Beesley, M.; Cauwe, M.; Baets, J. de

:

Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.1 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 1-4244-2813-0
ISBN: 978-1-4244-2814-4
pp.315-320
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded components, superior electrical performance by short and geometrically well controlled interconnects as well as a homogeneous mechanical environment of the chips, resulting in good reliability. At PCB manufacturing level, 50 µm thin chips have been embedded with pitches up to 200 µm in up to 18"x2" panels. Embedding of chips at 100µm pitch has been achieved at prototype level. Further developments of chip embedding can extend to even finer pitches without redistribution methods only with concurrent developments in ultra fine line patterning, plating methods and chemistries, assembly machines. New manufacturing processes should combine PCB processing and die assembly in one production line in order to benefit the most from this combination without the difficulties of transport between different manufacturing plants. Furthermore, new testing methodologies will be developed and a new supply chain will be created due to incorporation of embedding technologies to PCB production. This paper discusses in detail the technology and manufacturing challenges arisen from the integration of embedding technologies to PCB manufacturing processes.

: http://publica.fraunhofer.de/documents/N-89651.html