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Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
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2008
Conference Paper
Titel
Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
Author(s)
Sari, F.
Wiemer, M.
Bernasch, M.
Bagdahn, J.
Hauptwerk
Semiconductor Wafer Bonding 10. Science, Technology, and Applications
Konferenz
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 2008
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) 2008
Electrochemical Society (Meeting) 2008
Electrochemical Society of Japan (Fall Meeting) 2008
DOI
10.1149/1.2982911
Language
English
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Fraunhofer-Institut für Lasertechnik ILT
Fraunhofer-Institut für Werkstoffmechanik IWM
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM