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Miniaturized camera system using advanced packaging techniques

: Jung, E.; Koch, M.; Schmitz, S.; Boutte, R.; Harvey, I.; Meacham, T.; Solzbacher, F.


IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Components, Assemblies, and Materials Association:
58th Electronic Components and Technology Conference 2008. Proceedings. Vol.2 : Lake Buena Vista, FL, 27 - 30 May 2008
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2230-2
Electronic Components and Technology Conference (ECTC) <58, 2008, Lake Buena Vista/Fla.>
Conference Paper
Fraunhofer IZM ()

Recent years have shown the tremendous need for visual recording in consumer, telecom and security. Especially mobile phones have driven that trend to today's ultra-small cameras embedded into the handset. While the image capture IC features ever-decreasing pixel geometries and surging megapixel numbers, the readout circuitry and optical systems are now challenged to follow-up with this trend. This paper describes a miniaturization approach using advanced packaging techniques for the electronic system (bare die assembly in stack-wirebond and flip-chip) onto a high density circuit board and leveraging a MEMS based optical system providing the possibility for variable focus lens an aperture concept. This can give rise to a camera including the optical system with just about 3mm x 10mm x 10mm total dimensions. For prototypes, some electronic bare dice are mimicked by de-capsulating the IC from the plastic housing and rebumping it for use as flip chip. This prototype procedure is also described. Operation of the MEMS device challenges the assembly technique for particulate free manufacturing of al back end processes. Bare die assembly with wirebond and flip chip provides ultimate miniaturization onto a rigid-flex multi layer PCB. The process flow for MOEMS assembly, electronic components assembly and final housing is designed to be generically applicable to current and future needs of ultraminiaturized cameras.