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Patent
Title

Vorrichtung und Verfahren zum Haeusen mikromechanischer Systeme

Other Title
Apparatus for housing micro electromechanical or micro-optoelectromechanical system, has opening which is formed in dry film layer arrangement positioned between surface of glass substrate and optical cover
Abstract
(A1) Eine Vorrichtung zum Haeusen eines mikromechanischen Systems (100) umfasst ein Substrat (102) mit einer Oberflaeche (104), an der das mikromechanische System (100) gebildet ist, eine transparente Abdeckung (110) und eine Trockenfilmschichtanordnung (120) zwischen der Oberflaeche (104) des Substrats (102) und der Glasabdeckung (110). Die Trockenfilmschichtanordnung (120) weist dabei eine Oeffnung (130) auf, so dass das mikromechanische System (100) an die Oeffnung angrenzt.

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US 20080164592 A1 UPAB: 20081024 NOVELTY - The apparatus has a dry film layer arrangement (120) between the surface of a glass substrate and an optical cover (110). An opening (130) is formed in the dry film layer arrangement. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) method for housing micro electromechanical system (MEMS) or micro-optoelectromechanical system (MOEMS); and (2) system containing apparatus for housing micromechanical or micro-optoelectrical system. USE - Apparatus for housing micro electromechanical or micro-optoelectromechanical systemsuch as charge coupled devices (CCD), bolometer arrays, thermopile arrays, pyroelectrical arrays, complementary MOS (CMOS) imagers and CMOS/CCD array (all claimed). ADVANTAGE - The flawless functioning of the MEMS and MOEMS is achieved, by the formation of opening.
Inventor(s)
Bakke, T.
Sandner, T.
Link to:
Espacenet
Patent Number
102007001518
Publication Date
2007
Language
German
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
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