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Flexibles Leiterplattenmaterial und Verfahren zum Herstellen desselben

Method for manufacturing of flexible printed circuit board material, involves separating dielectric layer between polymer substrate and copper layer and dielectric layer and copper layer are separated by vacuum process
 
: Günther, S.; Schönberger, W.; Straach, S.; Schiller, N.; Kichhoff, V.

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Frontpage ()

DE 102007021896 A: 20070510
DE 102007021896 A: 20070510
H05K0001
H05K0003
German
Patent, Electronic Publication
Fraunhofer FEP ()

Abstract
(A1) Die Erfindung betrifft ein flexibles Leiterplattenmaterial, umfassend ein Polymersubstrat und eine Kupfer-Schicht, sowie ein Verfahren zu dessen Herstellung, wobei zwischen Polymersubstrat und Kupfer-Schicht eine dielektrische Schicht abgeschieden wird und die dielektrische Schicht und die Kupfer-Schicht mittels Vakuumverfahren abgeschieden werden.

 

DE 102007021896 A1 UPAB: 20081212 NOVELTY - The method involves separating a dielectric layer (3) between polymer substrate (2) and copper layer (4). The dielectric layer and the copper layer are separated by vacuum process. The dielectric layers are formed from oxides such as titanium oxides or mixture of oxides or oxides or oxynitride, which are formed from one of the elements titanium, zinc, niobium, molybdenum, tin, tantalum or silicon. The polymer substrate consists of one of the materials polyamide, polyetylene naphthalene (PEN), polyetheretherketone (PEEK), polyetylene terephthalate (PET) or fluoropolymer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for flexible circuit board material has a polymer substrate. USE - Method for manufacturing of flexible printed circuit board material. ADVANTAGE - The dielectric layer between polymer substrate and copper layer is separated and the dielectric layer and the copper layer are separated by vacuum processThe dielectric layer and the copper layer are separated by vacuum process, and hence ensures high adhesive strength of the copper layer of the printed circuit board material and ensures assembly of conductive strips on the printed circuit board material in separating processes.

: http://publica.fraunhofer.de/documents/N-86205.html