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Solder bumping - a flexible joining approach for the precision assembly of optoelectronical systems

 
: Beckert, E.; Burkhardt, T.; Eberhardt, R.; Tünnermann, A.

:

Ratchev, Svetan (Ed.); Koelemeijer, Sandra (Co-Ed.); Westkämper, Engelbert (International Advisory Committee) ; International Federation for Information Processing -IFIP-, Working Group 5.5 Co-operation Infrastructure for Virtual Enterprises and Electronic Business:
Micro-assembly technologies and applications : IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS' 2008), Chamonix, France, February 10-13, 2008
New York, NY: Springer, 2008 (IFIP International Federation for Information Processing 260)
ISBN: 978-0-387-77402-2
ISBN: 0-387-77402-5
ISBN: 978-0-387-77405-3
ISSN: 1571-5736
pp.139-147
International Precision Assembly Seminar (IPAS) <4, 2008, Chamonix>
English
Conference Paper
Fraunhofer IOF ()
optic; microassembly; laser beam soldering; Bumping; jetting

Abstract
For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex environments as well as with submicron accuracy.

: http://publica.fraunhofer.de/documents/N-84733.html