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Process optimization by means of integrated monitoring tools in the semiconductor industry

: Pfitzner, L.H.; Nutsch, A.; Roeder, G.; Schellenberger, M.


Schroder, D.K. ; Electrochemical Society -ECS-, Electronics and Photonics Division:
Analytical and diagnostic techniques for semiconductor materials, devices, and processes 7 : Symposium, part of the fall Electrochemical Society meeting in Washington, DC, held on October 7 - 12, 2007
Pennington, NJ: Electrochemical Society, 2007 (ECS transactions 11.2007, Nr.3: Dielectric and semiconductor materials, devices, and processing)
ISBN: 978-1-566-77579-3
ISBN: 978-1-566-77569-4
ISSN: 1938-5862
Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes Symposium <7, 2007, Washington/DC>
Electrochemical Society (Fall Meeting) <2007, Washington/DC>
Symposium "Analytical Techniques for Semiconductor Materials and Process Characterization" (ALTECH) <5, 2007, München>
Conference Paper
Fraunhofer IISB ()

Semiconductor manufacturing still follows Moorés Law, stating a cost reduction of approximately 25 to 30 % per year, a value actu-ally achieved in the past 40 years. One of the key enablers for fur-ther continuation of Moore's Law will be a much tighter process control. This paper describes aspects of Advanced Process Control and especially of integrated metrology, the foundation of process optimization by means of integrated process monitoring tools. Shortest response time requires that measurement methods have to be engineered as near as possible to the process itself, thus reduc-ing the time between processes, measurement and corrective ac-tions. Such integrated metrology is realized as in-line metrology, in situ metrology or virtual metrology. This paper presents the devel-opment of sensors, their integration and results for control of resist processing in lithography, use of according sensors for the control and endpoint detection in CMP processes, and novel methods for geometrical metrology in CMP process monitoring.