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Thermal shielding techniques for power electronic devices in high temperature applications

: Billmann, M.; Schimanek, E.; Buerhop, L.C.

MESAGO Messe Frankfurt GmbH, Stuttgart:
PCIM Europe 2007. Proceedings. CD-Rom : International Exhibition & Conference for Power Electronics, Intelligent Motion, Power Quality. 22 - 24 May 2007, Exhibition Centre Nuremberg
Stuttgart: MESAGO, 2007
International Exhibition & Conference for Power Electronics, Intelligent Motion, Power Quality <2007, Nürnberg>
Conference Paper
Fraunhofer IISB ()
cooling; finite element analysis; invertor; mechatronics; power electronics; shielding; thermal management packaging

This paper evaluates different methods to find a solution for heat shields inside integrated power electronic systems. Different device types with different heat impacts and possible protection measures are discussed. Arrangements of heat shields with no extra cost that reduce radiated as well as convective based heat impact are preferred. In dense integrated electronic arrangements mounting space is very rare. Therefore the additional use of already present components, such as a heat shield for temperature sensitive devices is a focus. Finite element analysis is used. Weak components like DC link capacitors, sensor elements and SMD components are mentioned. Design hints for dimensioning of such heat shields are given. Mechatronic design rules in terms of multifunctional use of components are highlighted by using electromechanical inverter parts for thermal cooling considerations. The goal is to improve reliability by decreasing temperature stress as well as to enable the use of lower cost components in a high temperature ambient condition.