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A new paste system for AlN
Ein neues Pastensystem für AlN
|Morris, J.E. ; International Microelectronics and Packaging Society -IMAPS-:|
International Symposium on Advanced Packaging Materials 2001. Proceedings : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 11 - 14, 2001
Washington, DC: IMAPS, 2001
|International Symposium on Advanced Packaging Materials <7, 2001, Braselton/Ga.>|
| Conference Paper|
|Fraunhofer IKTS ()|
| Aluminiumnitrid; Dickschicht; Widerstand; STOL|
At the IKTS the scientific assumptions and technological conditions were created to manufacture a complete paste system for hybrids and resistors on AlN. The high stability of the fired layers up to 250°C and the excellent microwave properties of the resistors make these FK-series especilly attractive for microwave and power applications. The resistors have a high current capacity. A conductor paste was developed maintaining the high adherence of the layer during Ni-plating and a AgPd-paste for plating through holes.