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Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
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2008
Journal Article
Titel
Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Author(s)
Lee, J.-S.
Chu, K.-M.
Patzelt, R.
Manessis, D.
Ostmann, A.
Jeon, D.Y.
Zeitschrift
Microelectronic engineering
DOI
10.1016/j.mee.2008.03.002
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM