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Advanced Micro-Dispensing System for Conductive Adhesives

 
: Gaugel, T.; Bechtel, S.; Neumann-Rodekirch, J.

:

Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4
pp.40-45
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam>
English
Conference Paper
Fraunhofer IPA ()
micro-dispensing system; conductivity; conductive adhesive

Abstract
As part of this paper, systems suitable for the micro-dispensing of conductive adhesives are presented and their advantages and disadvantages are also discussed. Additionally, cause-and-effect correlations of various influencing parameters are presented and analyzed, both for dispensing systems and for robotics. A further central theme is made up by the geometries of suitable needles for the precision dispensing of conductive adhesives.
In closing, a new technique developed at the Fraunhofer IPA for the high-accuracy dispensing of conductive epoxy resins is presented. The most important part of the new system is a micro-pump system combined with pneumatic micro-valve actuators.

: http://publica.fraunhofer.de/documents/N-8192.html