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Accurate characterization of package and board components for efficient system level signal integrity analysis

 
: Ndip, I.; Guttowski, S.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electromagnetic Compatibility Society:
IEEE International Symposium on Electromagnetic Compatibility, EMC 2007 : 9 - 13 July 2007, Honolulu, Hawaii
Piscataway, NJ: IEEE Operations Center, 2007
ISBN: 1-424-41349-4
ISBN: 1-424-41350-8
6 pp.
IEEE International Symposium on Electromagnetic Compatibility (EMC) <2007, Honolulu/Hawaii>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In order to prevent or minimize signal integrity (SI) and electromagnetic compatibility (EMC) problems in high-speed microelectronic systems, efficient system-level analyses must be carried out at the pre-layout stage, so as to develop reliable design measures. For these analyses, an accurate characterization of package and board components is required to extract realistic circuit models within the frequency range of interest. In this contribution, novel techniques for the extraction of such models are presented.

: http://publica.fraunhofer.de/documents/N-81630.html