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Design support for 3D-integration by physical oriented modeling of interconnect structures

Presentation held at 3-D Architectures for Semiconductor Integration and Packaging, 2007, Burlingame, California, 22.- 24. October 2007
 
: Schneider, P.; Reitz, S.; Wilde, A.; Stolle, J.; Weber, J.; Ramm, P.

:
Fulltext urn:nbn:de:0011-n-775921 (3.8 MByte PDF)
MD5 Fingerprint: 0d306fedb825ccd10360167c62e1a4ce
Created on: 14.8.2008


2007, 43 Folien
Conference "3-D Architectures for Semiconductor Integration and Packaging" <2007, Burlingame/Calif.>
English
Presentation, Electronic Publication
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

: http://publica.fraunhofer.de/documents/N-77592.html