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Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates

: Schmidt, J.-U.; Friedrichs, M.; Bakke, T.; Voelker, B.; Rudloff, D.; Lakner, H.


Ürey, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
MEMS, MOEMS, and Micromachining III. Proceedings : Strasbourg, France, 9 April 2008
Bellingham, WA: SPIE, 2008 (SPIE Proceedings Series 6993)
ISBN: 9780819471918
Paper 69930D
Conference "MEMS, MOEMS, and Micromachining" <3, 2008, Strasbourg>
Conference Paper
Fraunhofer IPMS ()

At Fraunhofer IPMS Dresden micromechanical mirror arrays are developed and fabricated using a high-voltage CMOS process for applications such as lithographic mask writers and adaptive optics. Different approaches for the fabrication of micromechanical mirror arrays with up to 1 million analogue addressable pixels in a MEMS-on-CMOS technology are discussed: sacrificial layer technologies of 1-level actuators made from a single Al-TiAl-Al structural multilayer or 2-level actuators with an additional TiAl hinge layer respectively. Also the fabrication of single crystalline Si micro-mirrors using layer-transfer bonding is discussed.