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Fiber optic strain and structural health monitoring in polymer electronic packaging

: Schreier-Alt, T.; Ansorge, F.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2007, the 57th Electronic Components and Technology Conference. Proceedings. Vol.4 : Sparks, NV, 29 May - June 1, 2007
Piscataway, NJ: IEEE Service Center, 2007
ISBN: 1-424-40985-3
ISBN: 1-424-40984-5
Electronic Components and Technology Conference (ECTC) <57, 2007, Reno/Nev.>
Conference Paper
Fraunhofer IZM ()