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2007
Conference Paper
Title

3D system integration

Abstract
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental concepts will be described, as well as appropriate handling concepts.
Author(s)
Klumpp, A.
Merkel, R.
Ramm, P.
Wieland, R.
Mainwork
13th International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2007  
Conference
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) 2007  
DOI
10.1109/VTSA.2007.378924
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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