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Printing solder paste in dry film - A low cost fine-pitch bumping technique
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2007
Conference Paper
Titel
Printing solder paste in dry film - A low cost fine-pitch bumping technique
Author(s)
Baumgartner, T.
Manessis, D.
Töpper, M.
Hauck, K.
Ostmann, A.
Reichl, H.
Goncalo, C.T.
Jorge, P.
Yamada, H.
Hauptwerk
EPTC 2007, 9th Electronics Packaging Technology Conference. Vol.2
Konferenz
Electronics Packaging Technology Conference (EPTC) 2007
DOI
10.1109/EPTC.2007.4469704
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM