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Printing solder paste in dry film - A low cost fine-pitch bumping technique

 
: Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.

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Vaidyanathan, K. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2007, 9th Electronics Packaging Technology Conference. Vol.2 : 10 - 12 December 2007, Grand Copthorne Waterfront Hotel, Singapore
New York, NY: IEEE, 2007
ISBN: 1-4244-1324-9
ISBN: 978-1-4244-1324-9
pp.609-612
Electronics Packaging Technology Conference (EPTC) <9, 2007, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-74898.html