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New sensor packaging concept for avionic application

 
: Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H.

:

Keyun, B. ; China Electronic Packaging Society; Institute of Electrical and Electronics Engineers -IEEE-:
8th International Conference on Electronics Packaging Technology, ICEPT 2007 : Shanghai, China, August 14th - 17th, 2007
Piscataway, NJ: IEEE Operations Center, 2007
ISBN: 1-424-41391-5
ISBN: 978-1-424-41391-1
ISBN: 1-4244-1392-3
pp.1-4
International Conference on Electronics Packaging Technology (ICEPT) <8, 2007, Shanghai>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-74896.html