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Impact of Si DRIE on vibratory MEMS gyroscope performance

: Merz, P.; Pilz, W.; Senger, F.; Reimer, K.; Grouchko, M.; Pandhumpsoporn, T.; Bosch, W.; Cofer, A.; Lassig, S.


Delapierre, G. ; Institute of Electrical and Electronics Engineers -IEEE-:
Transducers & Eurosensors 2007. 14th International Conference on Solid-State Sensors, Actuators and Microsystems. Vol.1 : June 10-14, 2007, Lyon, France
New York, NY: IEEE, 2007
ISBN: 1-4244-0841-5
ISBN: 978-1-4244-0841-2
ISBN: 1-4244-0842-3
European Conference on Solid-State Transducers (Eurosensors) <21, 2007, Lyon>
International Conference on Solid-State Sensors, Actuators and Microsystems <14, 2007, Lyon>
Conference Paper
Fraunhofer ISIT ()

Today angular rate sensors (gyroscopes) for automotive application are fabricated by a silicon surface micromachining process (SMM). One critical performance parameter of these micromachined vibratory gyroscopes is the mechanical coupling between the drive and sense mode due to manufacturing imperfections. Excessive coupling, called quadrature error, leads to large zero rate output (ZRO or Q-Bias). This paper discusses for the first time, the dependence between quadrature error and profile asymmetries in relevant spring structures with respect to non-uniformities of the silicon deep reactive ion etch (Si DRiE) systems used for the SMM processing.