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Interconnect challenges in highly integrated MEMS/ASIC subsystems
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2007
Conference Paper
Titel
Interconnect challenges in highly integrated MEMS/ASIC subsystems
Author(s)
Marenco, N.
Reinert, W.
Warnat, S.
Hauptwerk
Design, Test, Integration and Packaging of MEMS/MOEMS
Konferenz
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2007
DOI
10.24406/publica-fhg-356456
File(s)
001.pdf (665.29 KB)
Language
English
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Fraunhofer-Institut für Siliziumtechnologie ISIT