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Process models for advanced annealing schemes and their use in device simulation

Prozessmodelle für fortschrittliche Ausheilsysteme und ihre Anwendung in der Bauelementesimulation
 
: Pichler, P.; Martinez-Limia, A.; Kampen, C.; Burenkov, A.; Schermer, J.; Paul, S.; Lerch, W.; Gelpey, J.; McCoy, S.; Kheyrandish, H.; Pakfar, A.; Tavernier, C.; Bolze, D.

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Institute of Electrical and Electronics Engineers -IEEE-:
8th International Workshop on Junction Technology, IWJT 2008 : May 15 - 16, 2008 Shanghai, China
Piscataway: IEEE, 2008
ISBN: 978-1-4244-1737-7
ISBN: 978-1-4244-1738-4
pp.120-125
International Workshop on Junction Technology (IWJT) <8, 2008, Shanghai>
English
Conference Paper
Fraunhofer IISB ()
activation; diffusion; boron; arsenic; silicon; process simulation; device simulation; spike annealing; flash annealing

Abstract
In industrial environments, Technology Computer-Aided Design is used intensively for the design and optimization of new device architectures. To maintain its usefulness for future technology nodes, process simulation has to be able to predict the activation and distribution of dopants after advanced implantation and annealing schemes. Such annealing strategies will be based either on millisecond annealing at high temperatures or solid-phase epitaxial regrowth. In our contribution we will discuss diffusion and activation models for boron and arsenic. The models were calibrated for a wide range of annealing conditions, ranging from lowtemperature annealing up to millisecond flash annealing. Special emphasis is given on their implementation into Sentaurus Process and on their application for the simulation of advanced device architectures.

: http://publica.fraunhofer.de/documents/N-74019.html