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Industrial realization of dry plasma etching for PSG removal and rear side emitter etching

: Rentsch, J.; Decker, D.; Hofmann, M.; Schlemm, H.; Roth, K.; Preu, R.

Fulltext urn:nbn:de:0011-n-734951 (140 KByte PDF)
MD5 Fingerprint: 2167a0603ba2a79e6e5e852ec480e25d
Created on: 22.9.2012

European Commission, Joint Research Centre -JRC-:
The compiled state-of-the-art of PV solar technology and deployment. 22nd European Photovoltaic Solar Energy Conference, EU PVSEC 2007. Proceedings of the international conference. CD-ROM : Held in Milan, Italy, 3 - 7 September 2007
München: WIP-Renewable Energies, 2007
ISBN: 3-936338-22-1
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <22, 2007, Milano>
Conference Paper, Electronic Publication
Fraunhofer ISE ()

Inline production sequences are gaining more and more importance considering improved material flow and decreasing wafer material thickness. With the application of dry phosphorus silicate glass (PSG) etching combined with a subsequent SiNx deposition a further simplification of the process flow can be reached. Within this work, a new prototype etching and deposition system from Roth&Rau (called MAiA) is presented implementing a dry PSG removal, a single side emitter etch for the rear side as well as a SiNx deposition without leaving the vacuum line. Each process step itself has been tested and optimized and complete multicrystalline silicon solar cells have been produced implementing the new process sequence.