Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Detailed analysis of fine line printed and plated solar cell contacts

 
: Pysch, D.; Mette, A.; Filipovic, A.; Glunz, S.W.

:
Fulltext urn:nbn:de:0011-n-734945 (572 KByte PDF)
MD5 Fingerprint: e894e2a7c2414eecdfb6ceeec8c9bf60
Created on: 21.9.2012


European Commission, Joint Research Centre -JRC-:
The compiled state-of-the-art of PV solar technology and deployment. 22nd European Photovoltaic Solar Energy Conference, EU PVSEC 2007. Proceedings of the international conference. CD-ROM : Held in Milan, Italy, 3 - 7 September 2007
München: WIP-Renewable Energies, 2007
ISBN: 3-936338-22-1
pp.1238-1243
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <22, 2007, Milano>
English
Conference Paper, Electronic Publication
Fraunhofer ISE ()

Abstract
This work presents a detailed analysis of the new two-layer process to contact industrial solar cells. The seed layer was created by a pad printer and thickened by light-induced plating of silver. These contact structures were investigated microscopically aiming for a better understanding of the observed solar cell results. First we analysed the influence of the geometry of the seed-layer on IV-parameter. Next, the dependence of the contact resistance on the width of the seed-layer was measured and compared with theoretical expectations. This comparison resulted in the conclusion that the contact resistivity decreases with a reduction of the seed layer width. These results have been further approved by an analysis of SEM-pictures of wet chemically etched contacts. Contact resistance (Rc) measurements before and after light-induced plating of silver showed surprisingly a positive influence of the plating process on Rc. A detailed microscopical analysis revealed four new possible current flow paths due to the light-induced plating of a conventional contact or a seed layer. The results led to an extension of the existing model for a screen-printed contact.

: http://publica.fraunhofer.de/documents/N-73494.html