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Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers

: Bock, K.; Landesberger, C.; Bleier, M.; Bollmann, D.; Hemmetzberger, D.

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CS MANTECH, 20th International Conference on Compound Semiconductor Manufacturing Technology 2005 : New Orleans, Louisiana, April, 11 - 14, 2005
St. Louis: GaAS MANTECH Inc., 2005
ISBN: 1-893580-06-7
4 pp.
International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH) <20, 2005, New Orleand/La.>
Conference Paper, Electronic Publication
Fraunhofer IZM ()
thin wafer processing; reversible bonding; wafer carrier

Mobile electrostatic carriers enable secure and reversible attachment of very thin semiconductor wafers by electrostatic forces which are induced by a permanent polarization state of a dielectric layer. The paper reports on the electrical and thermal characterization of electrostatic carriers, also called "Smart Carriers", prepared by thick film technology on alumina substrates and by thin film technology on silicon substrates. Development work revealed the strong impact of leakage currents when durable attractive forces at temperatures above 250 °C have to be attained. When using silicon as substrate material the electrostatic attraction was active for more than 1 hour at temperatures of 400 °C.