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Handling ultra-thin wafers

Mobile electrostatic carriers enable bumping
: Landesberger, C.; Scherbaum, S.; Bollmann, D.; Bock, K.

Advanced packaging 16 (2007), No.4, pp.32-38
ISSN: 0747-1599
ISSN: 1065-0555
Journal Article
Fraunhofer IZM ()

A novel carrier technique for thin-wafer processing uses electrostatic forces for reversible attachment of delicate wafers to a rigid support substrate. This mobile electrostatic carrier is based on e-chucks that are currently built into processing equipment, but has been adapted to make transport and handling feasible.