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  4. Vertically coupled microring laser devices based on InP using BCB waferbonding
 
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2007
Conference Paper
Title

Vertically coupled microring laser devices based on InP using BCB waferbonding

Abstract
In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides the integration of an optical transparent passive bus waveguide vertically coupled to the active ring laser. Entnommen aus <a_href="http://www.fiz-technik.de/db/b_tema.htm" target="_blank">TEMA</a>
Author(s)
Hamacher, M.
Troppenz, U.
Heidrich, H.
Dragoi, V.
Mainwork
CLEO Europe - IQEC 2007. Conference digest. CD-ROM  
Conference
Conference on Lasers and Electro-Optics Europe (CLEO Europe) 2007  
International Quantum Electronics Conference (IQEC) 2007  
DOI
10.1109/CLEOE-IQEC.2007.4385912
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • III-V semiconductors

  • indium compounds

  • integrated optics

  • laser cavity resonator

  • micro-optics

  • optical fabrication

  • optical waveguide

  • ring laser

  • semiconductor laser

  • wafer bonding

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