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Vertically coupled microring laser devices based on InP using BCB waferbonding

: Hamacher, M.; Troppenz, U.; Heidrich, H.; Dragoi, V.

DOI: 10.1109/CLEOE-IQEC.2007.4385912

	Institute of Electrical and Electronics Engineers -IEEE-: CLEO Europe - IQEC 2007. Conference digest. CD-ROM : Munich, Germany, 17 - 22 June Piscataway, NJ: IEEE, 2007 ISBN: 1-4244-0931-4 ISBN: 978-1-4244-0931-0 1 pp.
	Conference on Lasers and Electro-Optics Europe (CLEO Europe) <2007, München> International Quantum Electronics Conference (IQEC) <2007, München>

	English
	Conference Paper
	Fraunhofer HHI ()
	III-V semiconductors; indium compounds; integrated optics; laser cavity resonator; micro-optics; optical fabrication; optical waveguide; ring laser; semiconductor laser; wafer bonding

Abstract
In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides the integration of an optical transparent passive bus waveguide vertically coupled to the active ring laser.
Entnommen aus TEMA

: http://publica.fraunhofer.de/documents/N-71415.html