Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
| Scripta materialia 58 (2008), No.7, pp.606-609
ISSN: 1359-6462 |
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| English |
| Journal Article |
| Fraunhofer IZM () |