English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Details
Full
Export
Statistics
Options
2008
Journal Article
Titel
Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Author(s)
Yu, D.Q.
Oppermann, H.
Kleff, J.
Hutter, M.
Zeitschrift
Scripta materialia
DOI
10.1016/j.scriptamat.2007.11.020
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM