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Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow

 
: Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.

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Scripta materialia 58 (2008), No.7, pp.606-609
ISSN: 1359-6462
English
Journal Article
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-70994.html