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Modelling effects of packaging on pull-in behaviour of doubly-anchored beams

 
: Lishchynska, M.; O'Mahony, C.; Slattery, O.; Wittler, O.

:

Ernst, L.J. ; Institute of Electrical and Electronics Engineers -IEEE-:
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 : Proceedings of the EuroSimE 2006, April 24-26, Como, Italy
New York, NY: IEEE, 2006
ISBN: 1-4244-0275-1
ISBN: 978-1-4244-0275-5
pp.68-73
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <7, 2006, Como>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thickness are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved.

: http://publica.fraunhofer.de/documents/N-69223.html