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Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

Charakterisierung der Grenzflächen von pulvermetallurgisch hergestellten Cu/Diamant-Verbundwerkstoffen für Anwendungen als Wärmesenken
 
: Schubert, T.; Ciupinski, L.; Zielinski, W.; Michalski, A.; Weißgärber, T.; Kieback, B.

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Scripta materialia 58 (2008), No.4, pp.263-266
ISSN: 1359-6462
English
Journal Article
Fraunhofer IFAM, Institutsteil Pulvermetallurgie und Verbundwerkstoffe Dresden ()
Kupfer; Kühlkörper; Diamant; Dispersionsgefüge; Grenzschicht-fest-fest; Pulvermetallurgie; Thermischer Ausdehnungskoeffizient; Grenzflächenreaktion; Kupferchromlegierung

Abstract
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer.
Entnommen aus TEMA

: http://publica.fraunhofer.de/documents/N-68997.html