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2008
Journal Article
Titel
Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications
Alternative
Charakterisierung der Grenzflächen von pulvermetallurgisch hergestellten Cu/Diamant-Verbundwerkstoffen für Anwendungen als Wärmesenken
Abstract
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer. Entnommen aus <a_href="http://www.fiz-technik.de/db/b_tema.htm" target="_blank">TEMA</a>