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Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects

 
: Auersperg, J.; Klein, M.; Michel, B.

Institute of Electrical and Electronics Engineers -IEEE-:
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics & Micro System 2007. Vol.1 : London, United Kingdom, 15 - 18 April 2007
Piscataway, NJ: IEEE, 2007
ISBN: 1-4244-1105-X
ISBN: 1-4244-1106-8
pp.97-104
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics & Micro System (EuroSimE) <2007, London>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Electronics components especially in the field of RF, optoelectronics, high temperature and power applications are often exposed to extreme thermal environmental conditions, mechanical vibrations and shock. Simultaneously, the well known thermal expansion problem of the several materials brought together, residual stresses generated by several steps of the manufacturing process and various kinds of inhomogeneity attribute to interface delamination, chip cracking and fatigue of interconnects. For that reason, design studies on the basis of parameterized FE-models and DOE/RSM-approaches are performed to optimize electronic components at early phases of the device development process. The applied methodologies typically base on classical stress/strain strength evaluations or/and life time estimations of solder interconnects using modified Coffin-Manson approaches. Recent studies show also how the evaluation of mixed mode interface delamination phenomena, classical strength hypotheses along with fracture mechanics approaches and thermal fatigue estimation of solder joints can simultaneously be taken into account. This contribution is now coupling such an integrated approach with optimization algorithms towards a thermomechanical reliable design whereas, the attention is also turned to the robustness against scattering model parameters (scattering of geometry and/or materials properties), in particular.

: http://publica.fraunhofer.de/documents/N-68452.html