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Reliability analysis for smart systems on the way from micro to nano

 
: Michel, B.; Auersperg, J.; Vogel, D.

Gessner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart systems integration 2007 : Paris, France 27. - 28.03.2007; With CD-ROM / 1st European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2007
ISBN: 3-8007-3009-X
ISBN: 978-3-8007-3009-4
pp.303-306
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <1, 2007, Paris>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Reliability analysis for high technology products has become more and more important recently. The variety of very different materials connected within very small regions has led to a lot of very difficult reliability problems, most of them being related to thermal and mechanical misfit/mismatch at the interface between the different materials. Combined simulation and experiments have a mayor influence on the quality and reliability of the products. The authors deal with reliability approach for sensors, MEMS, and automotive electronics systems using advanced micro- and nanotechnologies (e.g. chip interconnection technologies and related system integration techniques). One important focus is a coupled field approach (multiphysics - mechnaical, thermal, electrical, diffusion phenomena, vibration etc.) combined with reliabiltiy and life-time concepts based on combined simulation and testing methods using parameterized modelling, DOE etc. Digital image correlation techniques used for local deformation analysis within a FIB, AFM, AFAM, SEM etc. has been coupled with simulation and reliability and life-time prediction for smart systems. The authors apply their approach for automotive sensors, automotive high-temperature electronics and related topics.

: http://publica.fraunhofer.de/documents/N-68329.html