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Thermo-mechanical simulation of inter-chip via reliability for 3D-integration

: Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-, Deutschland:
Deutsche IMAPS-Konferenz 2007 : Montag/Dienstag, 8. - 9. Oktober 2007, München
München, 2007
Deutsche IMAPS-Konferenz <2007, München>
Conference Paper
Fraunhofer IZM ()

The present investigation shows a way to examine the present investigation shows a way to examine (ICV) for 3D chip stacking after processing and under external thermal loads relevant for the envisaged field of application (mobile, automotive) by combined Finite Element simulation and Nano-Indentation. The investigation proceeds as follows: Elasto-plastic data of the Materials are determined via nano-indentation. For the reproduction of the data the above-mentioned Finite Element simulations are used in order to extract local material properties such as E-modulus und yield stress. The accumulated plastic strain under periodic thermal loading of an ICV is considered as failure indicator. In order to obtain first design guidelines for this new technology, geometry, material and process related parameters are varied.