Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Plasma-printing and galvanic metallization hand in hand - a new technology for the cost-efficient manufacture of flexible printed circuits

: Möbius, A.; Elbick, D.; Borris, J.; Thomas, M.; Zänker, A.; Klages, C.-P.; Weidlich, E.-R.; Feldmann, K.; Schüßler, F.

National Technical University of Athens -NTUA-:
Nanotechnology and innovative coatings. CD-ROM : Euro Interfinish 2007; October 18 - 19, Athens, Greece
Athens, 2007
5 Bl.
International Conference "Euro-Interfinish" <2007, Athens>
Conference Paper
Fraunhofer IST ()

A new potentially cost-efficient technology combining patterned atmospheric pressure dielectric barrier discharge (DBD) treatrnent, here referred to as plasma-printing, and galvanic plating for the production of flexible printed circuits (FPC) is presented in this contribution. The technology is being jointly developed by partners frorn industry and academia, a major aim being the realization of the processes in a reel-to-reel production system. So far, plasma-printing experiments have been carried out using lab-scale batch plants. Using suitable electroless plating baths, RFID-like tag and interdigital structures with line widths and spaces down to 200 µm could already be produced. Adhesion of copper on DBD treated polyimide foil reached up to about 1 N/mm, as was determined in a peel test similar to that described in the DIN 53494.