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Selfassembly of micro components with microfluidics

 
: Boufercha, Nourdin; Sägebarth, Joachim; Burgard, Matthias; Othman, Nabih; Schäfer, Wolfgang; Sandmaier, Hermann

Gradetsky, V. ; Russian Academy of Sciences, Institute for Problems in Mechanics, Moscow:
International Workshop on Micro- and Nano Production Technologies and Systems 2007 : Proceedings. Micro- and Nano Production Technologies and Systems, October 17-18, 2007, Moscow, Russia
Moskau, 2007
pp.44-52
Workshop on Micro- and Nano Production Technologies and Systems <2007, Moscow>
English
Conference Paper
Fraunhofer IPA ()
Mikrokomponenten; Mikromontage; self-assembly; micro component; Mikrotechnik; Mikrofluidik; micro fluidic

Abstract
Latest roadmaps indicatre that the size of assembled silicon chips will dramatically be reduced. The size of these chips will be less than 500qm x 500 qm and will have a thickness lower than 50 to 70 qm. This reduction allows the use of flexible substrates and reduces the cost of the component as well. In parallel the costs of the manufacturing process should also be reduced.

: http://publica.fraunhofer.de/documents/N-67225.html