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Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen

 
: Deplanque, S.; Nüchter, W.; Wunderle, B.; Walter, H.; Michel, B.

:

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Thermal and mechanical simulation and experiments in microelectronics and microsystems. EuroSimE 2004 : Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, May 10 - 12, 2004, Novotel Tour Noire, Brussels, Belgium
Piscataway, NJ: IEEE, 2004
ISBN: 0-7803-8420-2
ISBN: 0-7803-8421-0
pp.351-358
International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <5, 2004, Brüssel>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The time and temperature dependant creep deformation of solder alloys has to be studied to describe material characteristics and failure behaviour in order to use it for lifetime evaluation by FE-simulations. It is often found in literature that material behaviour of eutectic SnPb solder is described considering only secondary creep. As this paper will show, primary creep may not be neglected because of its appearance in the performed characterisation tests and application examples. To study the creep behaviour, the grooved lap geometry described by Reinikainen was used and additionally modified to see crack and cavities in the solder joint using SAM (Scanning Acoustic Microscope). The test specimen was cyclically loaded for different stress levels and temperatures. Primary and secondary creep was observable under conditions of load reversal. A combined creep law using primary and secondary creep will be presented and an example is shown to highlight the relevance of the primary creep.

: http://publica.fraunhofer.de/documents/N-67174.html