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Stackable thin film multi layer substrates with integrated passive components

 
: Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.

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Institute of Electrical and Electronics Engineers -IEEE-:
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM : May 30 - June 2, 2006, held at Sheraton, San Diego, California
New York, NY: IEEE, 2006
ISBN: 1-4244-0152-6
Electronic Components and Technology Conference (ECTC) <56, 2006, San Diego/Calif>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-66245.html