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Stackable thin film multi layer substrates with integrated passive components
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2006
Conference Paper
Titel
Stackable thin film multi layer substrates with integrated passive components
Author(s)
Zoschke, K.
Buschick, K.
Scherpinski, K.
Fischer, T.
Wolf, J.
Ehrmann, O.
Jordan, R.
Reichl, H.
Schmuckle, F.J.
Hauptwerk
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM
Konferenz
Electronic Components and Technology Conference (ECTC) 2006
DOI
10.1109/ECTC.2006.1645750
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM