Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
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Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F. | Institute of Electrical and Electronics Engineers -IEEE-:
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM : May 30 - June 2, 2006, held at Sheraton, San Diego, California
New York, NY: IEEE, 2006
ISBN: 1-4244-0152-6
pp.705-708 |
| Electronic Components and Technology Conference (ECTC) <56, 2006, San Diego/Calif> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |